KB-6167F，高TG無鉛環氧覆銅板采用優質玻璃纖維布及環氧樹脂經特別工藝壓制而成，擁有較高的TG值,TG170可使它在更加高的溫度中工作．

特性：

●?Tg 170(DSC 測試),低Z軸 CTE值  Tg 170℃ (DSC Testing),low Z-axis expansion

●?相容紫外光阻擋及光學自動檢查功能,可提高PCB生產效率與準確性 UV Blocking and AOI (automatic optical inspection) compatible， so as to increase
productivity and accuracy

● 熱裂解溫度高 High Thermal Delamination
● 優良的耐熱性,能滿足無鉛制程要求 Excellent heat resistance and appropriate for lead-free assembly

●?符合IPC-4101B的規范要求?IPC-4101B?specification?is?applicable

應用領域：

●計算機及外圍設備  Computer and peripheral

●通訊設備 Communication equipment

●儀器儀表 instrument

●辦公自動設備 OA equipment,etc

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